ASM phoenix bonding equipment: 6pcs + Die bonder: 2pcs

 Capacity: 30K/day

SMT   ： JUKI mounting equipment: 3pcs +AOI equipment.

 Mounting 5M points/day

Wave Solder：The line of Insert through-hole components and hand soldering: 4pcs 

 2Mpcs PCB/day

Skill   ：0402，0603，1005, SOT

     SOIC, SOJ, QFP, BGA 74x74 (0.4 mm)

Process   :  Glue

 Reflow process with Rosh, AOI

Testing ： Functional and system testing

 Maintenance for Hardware & Software, product development.